Zhuzhou Jiabang Refractory Metal Co., Ltd
5 1

Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Block Heat Sink

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Zhuzhou Jiabang Refractory Metal Co., Ltd
[China]

Address
No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, Zhuzhou Hunan
Phone
86-0733-28410199
Contact name
Xu

Quick Information

  • Brand Name: JBNR
  • Place of Origin: China
  • Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Description

BTF (Butterfly) Package Baseplate CuW , CuMo Hermetic Packages Electronics materials

 

 

Description:

 

CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.

 

CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

 

 

Advantages:

 

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low void

 

Product Properties:

 

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20)

Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25) /176 (100)
85WCu 85±2% 16.4 7.2 190 (25) / 183 (100)
80WCu 80±2% 15.65 8.3 200 (25) / 197 (100)
75WCu 75±2% 14.9 9.0 230 (25) / 220 (100)
50WCu 50±2% 12.2 12.5 340 (25) / 310 (100)
         
         
Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25)/156(100)
70MoCu 70±2% 9.8 7 200(25)/196(100)
60MoCu 60±2% 9.66 7.5 222(25)/217(100)
50MoCu 50±2% 9.5 10.2 250(25)/220(100)

 

 

Application:

 

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

 

Product picture:

 


Product Image

  • Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Block Heat Sink image

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